发明名称 |
Manufacturing process for printed wiring board |
摘要 |
It is an object to provide a manufacturing process for a printed wiring board in which a copper foil and resin as a substrate material of a copper clad laminate are irradiated with carbon dioxide gas laser light to drill in both of them simultaneously. In forming a through hole or a hole such as IVH, BVH or the like in the copper clad laminate using carbon dioxide gas laser light, one of a nickel layer of 0.08 to 2 mum in thickness, a cobalt layer of 0.05 to 3 mum in thickness and a zinc layer of 0.03 to 2 mum in thickness is formed as an additional metal layer on a surface of the copper foil residing in an external layer of the copper clad laminate and thereafter, by performing laser drilling, the copper foil layer and the resin layer as a substrate material of the copper clad laminate are enabled to drill simultaneously.
|
申请公布号 |
US6716572(B2) |
申请公布日期 |
2004.04.06 |
申请号 |
US20020082154 |
申请日期 |
2002.02.26 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
YAMAMOTO TAKUYA;KATAOKA TAKASHI;HIRASAWA YUTAKA;TAKAHASHI NAOTOMI |
分类号 |
H05K3/00;H05K3/46;(IPC1-7):G03F7/00;G03F7/26 |
主分类号 |
H05K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|