发明名称 |
Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus |
摘要 |
A dresser is used which makes it possible to simultaneously dress and condition the surface of a polishing pad deteriorated by polishing a semiconductor wafer in the CMP process. The dresser is a dresser comprised of a ceramic such as dressing SiC, SiN, alumina or silica. Use of this dresser enables to shorten the time of dressing/conditioning the deteriorated polishing pad.
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申请公布号 |
US6716087(B2) |
申请公布日期 |
2004.04.06 |
申请号 |
US20010839240 |
申请日期 |
2001.04.23 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MIYASHITA NAOTO;MINAMI YOSHIHIRO |
分类号 |
B24B37/04;B24B53/017;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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