发明名称 Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus
摘要 A dresser is used which makes it possible to simultaneously dress and condition the surface of a polishing pad deteriorated by polishing a semiconductor wafer in the CMP process. The dresser is a dresser comprised of a ceramic such as dressing SiC, SiN, alumina or silica. Use of this dresser enables to shorten the time of dressing/conditioning the deteriorated polishing pad.
申请公布号 US6716087(B2) 申请公布日期 2004.04.06
申请号 US20010839240 申请日期 2001.04.23
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MIYASHITA NAOTO;MINAMI YOSHIHIRO
分类号 B24B37/04;B24B53/017;H01L21/304;(IPC1-7):B24B1/00 主分类号 B24B37/04
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