Semiconductor device having contact opening smaller than test probe, and manufacturing process and inspecting method thereof

摘要

In a semiconductor chip mounted in a semiconductor device, when an opening portion (2) is formed in a surface protective film (14) on a pad (13), the opening portion (2) is so formed as to have a plurality of openings (15), each smaller than a tip diameter of a probe needle (17) and arranged in a grid pattern or stripe pattern. In this configuration, electrical continuity is achieved between the probe needle (17) and the pad (13) through a bump electrode (16) if the bump electrode is properly formed. Electrical continuity between the probe needle (17) and the pad (13) is prevented by the opening (15) and is not achieved if the bump electrode (16) is improperly formed.