发明名称 |
Urethane oligomer, resin compositions thereof, and cured article thereof |
摘要 |
The present invention relates to a new urethane oligomer (A) and a resin composition comprising (A) and an unsaturated group containing polycarboxylic acid resin (B) that can be diluted with water and is excellent in providing a cured product and that is suitable for a solder resist and an interlayer dielectric layer because the cured product is excellent in flexibility, soldering-heat resistance or the like and allows a development with an organic solvent or a dilute alkali solution; a photosensitive resin composition suitable for an etching resist or a cover lay; and a photosensitive film obtained thereby.
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申请公布号 |
US6716892(B1) |
申请公布日期 |
2004.04.06 |
申请号 |
US20010914878 |
申请日期 |
2001.09.05 |
申请人 |
NIPPON KAYAKU KABUSHIKI KAISHA |
发明人 |
MORI SATOSHI;YOKOSHIMA MINORU;KIYOYANAGI NORIKO;MATSUO YUICHIRO;KOYANAGI HIROO |
分类号 |
C08F2/46;C08F283/00;C08F283/10;C08F290/00;C08F290/06;C08F290/14;C08G18/62;C08G18/67;C08G18/68;C08L63/10;C09D175/04;G03F7/027;G03F7/038;H05K3/28;(IPC1-7):C08L63/10;C08L75/14;C08L75/16;H05K1/02 |
主分类号 |
C08F2/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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