发明名称 |
DFR laminating and film removing system |
摘要 |
A DFR laminating and PET removing system which is capable of both laminating a dry film resist (DFR) layer on a semiconductor wafer and removing a DFR support film such as polyethylene terepthalate (PET) from the DFR layer on the wafer at a single location. The DFR laminating and PET removing system of the present invention comprises a PET support film removing head for removing a portion of PET film from the semiconductor wafer substrate after the PET film portion and dry film resist (DFR) portion are laminated from a DFR tape onto the wafer and before the DFR portion is cut from the DFR tape.
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申请公布号 |
US6715524(B2) |
申请公布日期 |
2004.04.06 |
申请号 |
US20020164987 |
申请日期 |
2002.06.07 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHEN LI-CHEN;HSU CHIA-TSUN;LIN CHIA-FU;LEE KUO-CHING;CHEN YEN-MING;CHING KAI-MING;LEE HSIN-HUI;SU CHAO-YUAN |
分类号 |
B05D5/12;B32B7/06;B41M3/12;B44C1/00;B44C1/165;(IPC1-7):B44C1/165;B32B31/20 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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