发明名称 |
Integrated balun and transformer structures |
摘要 |
An on-chip signal transforming device includes a substrate and a first conductive layer above the substrate, wherein the first conductive layer has a plurality of interleaved inductors. The device further includes a second conductive layer above the substrate, wherein the second conductive layer has at least one inductor.
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申请公布号 |
US6717502(B2) |
申请公布日期 |
2004.04.06 |
申请号 |
US20010012209 |
申请日期 |
2001.11.05 |
申请人 |
ATHEROS COMMUNICATIONS, INC. |
发明人 |
YUE CHIK PATRICK |
分类号 |
H01F41/04;H01F19/06;H01L21/822;H01L27/04;H03H7/42;(IPC1-7):H01F5/00 |
主分类号 |
H01F41/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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