发明名称 |
Low profile EMI shield with heat spreading plate |
摘要 |
A combined electromagnetic interference (EMI) shield and heat dissipation is comprised of a five-sided receptacle coupled to a heat spreading plate. The receptacle is composed of a shield material having an insulated interior coating. A compact, low profile assembly to house the motherboard of notebook computer achieves a significant reduction in vertical thickness by combining the functions of an EMI shield and heat dissipation structure.
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申请公布号 |
US6717799(B2) |
申请公布日期 |
2004.04.06 |
申请号 |
US20010875352 |
申请日期 |
2001.06.05 |
申请人 |
FUJITSU LIMITED |
发明人 |
HAMANO TAKESHI;YAMADA KEVIN SEICHI |
分类号 |
G06F1/16;G06F1/20;H01L23/36;H05K9/00;(IPC1-7):G06F1/16 |
主分类号 |
G06F1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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