发明名称 Method of forming memory arrays based on a triple-polysilicon source-side injection non-volatile memory cell
摘要 A method of forming a semiconductor memory having rows and columns of memory cells is as follows; forming a plurality of rows of program gate lines from a second layer polysilicon; forming a plurality of rows of select gate lines from a third polysilicon layer; forming a plurality of rows of diffusion source lines: forming a plurality of local bitlines from a first layer metal, the cells along each column being divided into a pre-designated number of groups, and drains of the cells in each group being connected to a local bitline extending across the cells in the group of cells; and forming a plurality of global bitlines from a second layer metal extending along every two columns of cells, each global bitline being configured to selectively provide electrical connection to the local bitlines along the corresponding two columns of cells.
申请公布号 US6716700(B2) 申请公布日期 2004.04.06
申请号 US20030421020 申请日期 2003.04.21
申请人 WINDBOND ELECTRONICS CORPORATION 发明人 LIU CHUN-MAI;KORDESCH ALBERT;CHANG MING-BING
分类号 G11C16/04;H01L27/115;H01L29/423;H01L29/51;H01L29/788;(IPC1-7):H01L21/336 主分类号 G11C16/04
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