发明名称 CHIP LED LIGHT EMITTING BODY AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip LED light emitting body by which there is no inconvenience in fitting of a reflection housing to a printed wiring board, there is no fear of damaging a packaging component in the case of fitting in addition, and charging work of an optical diffusion lens to the reflection housing is carried out properly and simply. <P>SOLUTION: The reflection housing 4 is injection-molded in the state of a continuous single body directly on the upper surface of the printed wiring board 1 with a setting drag block 2 for inserting the printed wiring board 1 and a cope block 3 for housing formation. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004103775(A) 申请公布日期 2004.04.02
申请号 JP20020262638 申请日期 2002.09.09
申请人 EESHIKKU KK 发明人 JINNO MASARU;KURIBAYASHI TOMOKUNI;AOYAMA TAKAMITSU
分类号 H01L33/54;H01L33/56;H01L33/60 主分类号 H01L33/54
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