| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an air-bearing cylinder that can contribute to the size reduction etc. of a component mounting device. <P>SOLUTION: A hollow hole 27 is formed through the rod 7 of the air-bearing cylinder 4 in the axial direction and a chip jig 31 which performs different kinds of works on a semiconductor chip when the rod 7 is driven is provided on the extension of the hollow hole 27. When this air-bearing cylinder 4 is used, the size of the component mounting device can be reduced, because working areas in which the different kinds of works are performed on the semiconductor chip by driving the rod 7 can be observed, and so on, through the hollow hole 27. <P>COPYRIGHT: (C)2004,JPO |
