| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive die bonder that is reduced in size and weight, can uniformly apply a load to a die, and is high in mounting accuracy. SOLUTION: A shaft 5 which works as a mobile shaft, a thrust shaft, and a rotary shaft is vertically movably and rotatably supported by an arm housing 2 through air bearings 3 and 4, and aθ-rotationally driving source 6 and a non-contacting type vertical movement control mechanism section 8 are respectively provided coaxially with the shaft 5 at positions between the air bearings 3 and 4. In addition, a collet 7 is provided at the lower end of the shaft 5 as a die handling section. The collet 7 is rotated by a prescribed angle in theθ-direction by means of the rotationally driving source 6. The vertically moving speed and vertically moved position of the collet 7 and, at the same time, the load of a die (semiconductor chip) sucked to the collet 7 are controlled by means of the control mechanism section 8. In addition, the angle of rotation and vertically moved position of the shaft 5 are detected and controlled by means of an angle-of-rotation detecting mechanism section 14 and a position detecting mechanism section 17. COPYRIGHT: (C)2004,JPO |
