| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which is capable of shortening the unit processing time. SOLUTION: A method of manufacturing a semiconductor device formed by bonding a chip on a board comprises a first process of fetching the chip from a prescribed position with a pickup/reversing tool, a second process of turning the chip upside down with the pickup/reversing tool, a third process of delivering the reversed chip to a bonding tool with the pickup/reversing tool, a fourth process of imaging the chip delivered to the bonding tool, a fifth process of moving the chip to a previously indicated position above the board while the bonding position of the chip on the board is calculated on the basis of the imaged picture, and a sixth process of bonding the chip on the board by positioning the chip moved to the indicated position at the bonding position calculated on the basis of the imaged picture. COPYRIGHT: (C)2004,JPO
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