| 摘要 |
PROBLEM TO BE SOLVED: To provide a bending method and its device that is designed to reduce warping after bending. SOLUTION: Bending is performed on a workpiece, with a thermal stress toward a bending line generated by a thermal cutter in parallel to the bending line direction at more than a prescribed distance across the bending line, before the start of the bending on the workpiece. The spacing between the stress generating place and the bending line has approximately the V width of a die to be used for the bending. The device is equipped with a thermal cutting head which is a warp preventive means. COPYRIGHT: (C)2004,JPO
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