| 摘要 |
A technique for forming imbedded microwave structures in a microwave circuit package is presented. In one method, windows are punched, stamped or molded into metal laminate plates. A metal laminate layer is formed by fusing each of the metal laminate plates one on top of another, preferably using a diffusion bonding technique. The metal laminate layer is fused on top of a metal base plate, which is adhered to a ceramic substrate, and a shielded cover is fused on top of the metal laminate layer to form the imbedded waveguide structure as the base plate, metal laminate plates, and cover plate are fused together. In another method, indented cavities are formed in a shielded cover. The shielded cover is then fused, preferably using a diffusion bonding technique, to a metal base plate, which is adhered to a ceramic substrate. The technique of the present invention may be used to form propagating waveguide structures which operate as transmission lines or resonant cavities, non-propagating waveguide structures which have extremely high cutoff frequencies and which are formed around microstrip transmission lines or microcircuitry to disallow energy below the cutoff frequency to propagate, a low cost, compact, efficient microcircuit-component-to-waveguide wire bond launch, and or a periscope-type waveguide in a microcircuit package. |
