| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing two metal tapes which can prevent the generation of voids within vias and peeling between a base material and a bonding agent, and simultaneously can improve adhesive strength between the bonding agent and a conductive layer, and the etching property of the conductive layer. <P>SOLUTION: A first conductive layer of laminated conductor foil is formed on only one surface of a base material, a via-hole with the conductive layer as a bottom is also formed. A via is formed by electrolytic plating using the conductive layer as a power feed layer after dry-cleaning the inside of the via-hole, or filling the entire via-hole with a conductor of conductive paste. A second conductive layer is formed on the other surface of the base material by wet-desmearing, non-electrolytic plating, electrolytic plating or by laminating the conductive foils. <P>COPYRIGHT: (C)2004,JPO</p> |
