| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a photocurable, thermosetting resin composition which has high sensitivity and simultaneously, excels in the flexing resistance, folding endurance, flexibility, plating resistance, heat resistance, and electrical properties required for solder resists to be used in flexible printed-wiring boards and TAB tapes. <P>SOLUTION: The photocurable, thermosetting resin composition comprises (A) a carboxy group-containing photocurable resin to be obtained by reacting a linear polyfunctional epoxy compound having a specific structure with an unsaturated monocarboxylic acid, and then reacting the resulting product with a polybasic acid anhydride, (B) a carboxy group-containing photocurable resin to be obtained by adding an alkylene oxide to a compound having three or more phenolic hydroxy groups in the molecule, partially esterifying the obtained alcoholic hydroxy groups with an unsaturated monocarboxylic acid, and furthermore adding a polybasic acid anhydride to unreacted alcoholic hydroxy groups, (C) a photopolyemrization initiator, (D) an epoxy resin having two or more epoxy groups in the molecule, and (E) a diluent. <P>COPYRIGHT: (C)2004,JPO</p> |
