| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To simultaneously open a large number of holes in a sheet in one laser beam irradiation, to improve the hole pitch accuracy, to shorten the machining time, and to reduce a machining cost. <P>SOLUTION: A photo mask 15 with a large number of holes patterned in advance is tightly fitted to a polyimide 16, and held to a recovery table 18 by a fixing piece 17 so that the photo mask 15 is not deviated from the polyimide 16. Laser beams 19 are focused thereon so that the polyimide 16 is melted or evaporated, and the polyimide 16 is moved together with the recovery table 18 while irradiating laser beams over the extensive range of the polyimide 16. Liquid and vapor generated by melting or evaporating the polyimide 16 are recovered by the recovery table 18. <P>COPYRIGHT: (C)2004,JPO</p> |
