| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming fine wiring which accommodates to reduction in size, thickness, and cost, superior in reliability, and stable in characteristics. SOLUTION: The method of forming fine wiring comprises a first process of forming a line electrode of a conductive film 4 provided with a protective film 6 formed on its top surface on a board 1, a second process of coating the top surface and side of the line electrode and the top surface of the board 1 with a protective film 7, and a third process of removing the protective film 7 which is formed on the board 1 as facing upward by anisotropic etching. The whole surface of the conductive film 4 is covered with the protective films 6 and 7, whereby the line electrode can be made highly reliable. Furthermore, the fine wiring is formed by anisotropic etching, so that only one process employs a photolithographic technique, and the fine wiring can be reduced in manufacturing cost. Materials and a method used for forming the protective films can be applied in a wide range, and a fine wiring having a high aspect ratio can be formed. COPYRIGHT: (C)2004,JPO
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