发明名称 HEAT PUMP DEVICE
摘要 PROBLEM TO BE SOLVED: To solve problems that required amount of a refrigerant to be filled is increased to fill the volume of a refrigerant receiver 6 with refrigerant because a heat pump device is provided with the refrigerant receiver 6 in a conventional configuration and design of a high pressure-resistant vessel is required in the refrigerant receiver 6, thereby increasing the cost of the heat pump device. SOLUTION: This heat pump device has a compressor 11 pressurizing refrigerant up to supercritical pressure, a heat radiation heat exchanger 12, and a heat absorption heat exchanger 13, and a refrigerant circuit 16 connecting them in this order. A high pressure side pressure reducing means 17 is provided on a heat radiation heat exchanger 12 side of the refrigerant circuit 16 connecting the heat radiation heat exchanger 12 with the heat absorption heat exchanger 13. A low pressure side pressure reducing means 18 is provided on a heat absorption heat exchanger 13 side. The heat pump device is characterized in that the pressure in the refrigerant circuit connecting the high pressure side pressure reducing means 17 with the low pressure side pressure reducing means 18 is set to an intermediate pressure between high pressure and low pressure. A control means 19 for changing intermediate pressure is provided in this heat pump device to be able to obtain refrigerant amount on a high pressure side which is optimum for operation. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004100979(A) 申请公布日期 2004.04.02
申请号 JP20020259778 申请日期 2002.09.05
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NISHIYAMA YOSHITSUGU;WATANABE TAKEJI;OHAMA MASAHIRO;KUNIMOTO KEIJIRO;MATSUMOTO SATOSHI;KONDO RYUTA;OKA KOJI;YASUKI SEIICHI;MO TATSUMURA
分类号 F25B1/00;F25B9/00;(IPC1-7):F25B1/00 主分类号 F25B1/00
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