发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DYNAMIC AMOUNT SENSOR
摘要 <P>PROBLEM TO BE SOLVED: To prevent the fracture of a movable part caused by water flow, water pressure and handling in mounting. <P>SOLUTION: Movable electrodes 24 of a beam structure are mounted at an upper part of a P-type silicon board 17 at predetermined intervals, and an acceleration is detected on the basis of the displacement of the movable electrodes 24 accompanying the action of the acceleration. In manufacturing the sensor, naphthalene 44 as a sublimating substance is placed on the P-type silicon board 17 including a part between the P-type silicon board 17 and the movable electrode 24, and naphthalene 44 is fixed. The mounting such as dicing cut, mounting, and wire bonding is performed in this condition. Here, the fracture of the movable electrodes 24 can be prevented as the movable electrodes 24 are fixed by naphthalene to prevent their movement, through the water flow in dicing cut and the vibration in wire bonding is applied to the movable electrode 24, or the handing is performed thereto. Naphthalene 44 is vaporized after the mounting. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004101528(A) 申请公布日期 2004.04.02
申请号 JP20030314030 申请日期 2003.09.05
申请人 DENSO CORP 发明人 KANO KAZUHIKO;SUGIURA MAKIKO;TAKEUCHI YUKIHIRO;YAMAMOTO TOSHIMASA
分类号 G01P9/04;G01C19/56;G01L1/18;G01P15/00;G01P15/08;G01P15/125;H01L29/84 主分类号 G01P9/04
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