| 摘要 |
PROBLEM TO BE SOLVED: To reduce the separation of functional plating in a process for producing a wiring board in which tin plating is formed on the entire surface of a wiring and then the functional plating different from the tin plating is formed partially on the tin plating. SOLUTION: In the process for producing a wiring board by forming a wiring (conductor pattern) on the surface of an insulating substrate, forming a tin plating on the entire surface of the wiring, and then forming functional plating different from the tin plating partially on the tin plating, preliminary plating is formed in the region for forming the functional plating while activating the surface of the tin plating before the functional plating is formed. COPYRIGHT: (C)2004,JPO
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