| 摘要 |
PROBLEM TO BE SOLVED: To obtain a highly bonded plated type circuit board material in which a resin layer formed on a heat-resistant film has a highly smooth surface and accommodates to fine pitches. SOLUTION: A three-layer plated printed circuit board has a resin layer on at least one surface of a heat-resistant resin film, and a conductive metal layer formed on the resin layer by sputtering or vapor deposition. In addition, this circuit board has an electroplated copper layer on the metal layer. The maximum height of the projection of the heat-resistant resin layer is adjusted to≤1μm. COPYRIGHT: (C)2004,JPO
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