| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component attaching structure that cools an electronic component with an air current generated in an air-conditioning duct, can surely seal the electronic component by absorbing the dimensional variation of the component or duct, and at the same time, can attain cost reduction by making mold tuning work more efficient. SOLUTION: In the electronic component attaching structure, the electronic component having a large heat generation rate is attached to the attaching opening of the air-conditioning duct, at the same time, airtightly clamped to the opening by means of a sealing means, and cooled with the air current generated in the duct. Further, the sealing means is extended in a cylindrical state from the internal wall of the duct around the attaching opening, and the front end of the inwardly bent inner pipe of the sealing means is constituted in an elastic dual-structured pipe edge 4 which is press-contacted with a sealing surface 35 formed on the outer periphery of the component. Consequently, the electronic component can be sealed surely by absorbing the dimensional variation of the component or duct, and at the same time, the cost reduction can be attained by making the mold tuning work more efficient. COPYRIGHT: (C)2004,JPO
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