| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a semiconductor encapsulation with high flame resistance, improved moisture resistant reliability, flowability, mold releasability and further a preventive effect for a package stain at the same time. SOLUTION: The composition contains (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler, (D) a flame retardant clathrate microcapsule including (d) a flame retardant of at least one selected from the group consisting of magnesium hydroxide, aluminum hydroxide, and metal hydroxides represented by formula (1) and zinc borates represented by formula (2), enclosed by non-porous globular silica fine particles. COPYRIGHT: (C)2004,JPO
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