发明名称 ANODE FORMING APPARATUS AND METHOD THEREFOR, METHOD OF MANUFACTURING SUBSTRATE, AND SUBSTRATE TREATMENT APPARATUS AND METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To surely provide electrodes in contact with a substrate, for example, without pressing the electrodes by a large force to the substrate held by a holding portion in the anode forming apparatus. SOLUTION: An aperture is provided at the bottom of an anode forming vessel 211, and an absorbing pad 251 is also arranged around the aperture. A negative electrode 201 is arranged at the upper part of a substrate 100 attracted by the absorbing pad 251, and a positive electrode 221 of a positive electrode structure body is pressed to the rear surface of the substrate 100. The positive electrode structure body 230 has a flexible contact security mechanism 230, and the positive electrode 221 is supported via the contact security mechanism 230. Accordingly, the positive electrode 221 is in contact with the rear surface of the substrate 100 on the entire surface of the contact surface as the front surface thereof by a small pressing force. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004103800(A) 申请公布日期 2004.04.02
申请号 JP20020263134 申请日期 2002.09.09
申请人 CANON INC 发明人 YANAGIDA KAZUTAKA;TSUBOI TAKASHI;SAKAGUCHI KIYOBUMI
分类号 H01L21/76;H01L21/02;H01L21/304;H01L21/3063;H01L21/336;H01L27/12;H01L29/786;(IPC1-7):H01L21/306 主分类号 H01L21/76
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