| 摘要 |
PROBLEM TO BE SOLVED: To remove residues and foreign matters by washing fine holes formed in a substrate using a plasma before filling the fine holes with molten metal. SOLUTION: The fine holes 3 are formed in a silicon substrate 1. Resist residues, foreign matters, and the like which are caused by the formation of the fine holes are washed away by using a plasma. Then, the silicon substrate 1 is dipped in the molten metal 15 at a pressure lower than the atmospheric pressure. The pressure at which the silicon substrate 1 was dipped in the molten metal 15 is raised to a pressure higher than that, and the fine holes 3 are filled with the molten metal by a difference in pressure. Thereafter, the silicon substrate 1 is pulled out from the molten metal 15. COPYRIGHT: (C)2004,JPO
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