发明名称 PLATING EQUIPMENT FOR NOZZLE AND NOZZLE
摘要 PROBLEM TO BE SOLVED: To surely prevent clogging in nozzles (1) when nozzle holes (2) are subjected to composite plating. SOLUTION: The composite plating prepared by dispersing polytetrafluoroethylene particles (5b) into an Ni-P matrix (5a) is formed on the surfaces of the nozzle holes (2). In forming such films (5), the nozzles (1) are vibrated in a solution while the solution is kept stirred and in addition, the solution is stirred within the nozzle holes (2) as well. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004100006(A) 申请公布日期 2004.04.02
申请号 JP20020265753 申请日期 2002.09.11
申请人 DAIKIN IND LTD 发明人 TAKEDA NOBUAKI
分类号 C25D5/14;C25D5/50;C25D15/02;C25D21/10;(IPC1-7):C25D21/10 主分类号 C25D5/14
代理机构 代理人
主权项
地址
您可能感兴趣的专利