| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a crack and a warp of a substrate and to improve the robustness reliability in a semiconductor device. <P>SOLUTION: The semiconductor device 1 is provided with a first substrate 3 which mounts a semiconductor chip 21 and on which a gel-like resin 24 coating the semiconductor chip 21 is formed, a second substrate 4 which is electrically connected to the first substrate 3, and a case member 2 fixing the first and second substrates 3 and 4 in a state where an interval is made in the thickness direction. The case member 2 is provided with a plate-like partition wall 5 dividing the first and second substrates 3 and 4, and with a recessed part 9 storing the first substrate 3 by making it face the resin 24 by leaving the interval from the partition wall 5. The first substrate 3 blocks an opening 9b of the recessed part 9. <P>COPYRIGHT: (C)2004,JPO |
