| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device module that realizes a small-sized mounting structure for an electronic device. <P>SOLUTION: This electronic device module has a wiring board and an electronic device integrated with the wiring board. The wiring board has a porous insulating substrate and conductor wiring formed of a conductive material selectively introduced into the multi-cellular structure of the insulating substrate. <P>COPYRIGHT: (C)2004,JPO |
