| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a copper-clad laminate suitable for a base material of all polyimide which solves the problems of being low in adhesive strength inherent in copper-clad laminates for base material and the poor transparency of the remaining polyimide film after an etched copper foil is removed. <P>SOLUTION: The copper-clad laminate is formed by laminating a polyimide film and a copper foil low in degree of coarseness or a copper layer and has a light transmission rate of not less than 40% at a wavelength of 600nm on the film in either case after the etching of the copper film or after the etching of the copper layer, with haze of not more than 30%, and an adhesive strength of not less than 500N/m. The laminate has an adhesive strength of not less than 285N/m after heat treatment at 150°C for 1,000 hours. <P>COPYRIGHT: (C)2004,JPO</p> |
