| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode structure for a piezoelectric vibrator in which electrical and mechanical strengths are improved in the case of bonding a piezoelectric vibrating element to a ceramic package. SOLUTION: A full electrode 11 is formed all over a principal surface of a crystal substrate 9 on the side of a recess by a means of deposition, and a main electrode 12 having a predetermined size as well as a lead electrode 13 extending from the main electrode 12 are similarly formed approximately in the middle of a thin portion formed with the recess on the principal surface of the crystal substrate 9 on the side of the recess by the means of deposition. Next, a pad electrode 17a is formed by sputtering to be thick in comparison with the other main electrode 12 and lead electrode 13, and conducted through the lead electrode 13. The pad electrode 17a secures the strength of the electrodes in the case of flip chip packaging using a bump 15a stuck on the pad electrode 17a and a Cr film is formed as a base when forming the pad electrode 17a to improve the bonding strength of the pad electrode and the crystal substrate. COPYRIGHT: (C)2004,JPO
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