| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is reduced in size by forming resin bumps by making effective use of a bottom face (mounting-side face) region thereof, and also to provide a downsized camera module using the semiconductor device of such a structure. <P>SOLUTION: On a mounting-side face of a molding resin 2 for sealing a semiconductor element 1, projecting portions 2a are formed. Then, on the mounting-side face of the molding resin 2, a metal film 3 is formed to form a pattern wiring. The metal film 3 is also formed on the projecting portions 2a to form the resin bumps 6. Immediately below a region where the semiconductor element 1 is mounted, resin bumps 6A are formed using projecting portions 4a formed of resin 4 for fixing the element. <P>COPYRIGHT: (C)2004,JPO |
