| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a flip chip Gunn diode improved in a heat radiating efficiency and reduced in a thermal resistance. <P>SOLUTION: An insulating film is formed on a recessed region formed around an anode electrode while penetrating an active layer and a second contact layer, then, a heat conductive layer on the insulating film by filling a thermably conductive material(gold, silver, copper or the like) is connected to a conductive projection (bump) to efficiently dissipate heat generated in the active layer. In addition to the above-described means, the conductive projection (bump) connected to the anode electrode and a cathode electrode is connected further to the heat conductive layer to improve a heat radiating efficiency. <P>COPYRIGHT: (C)2004,JPO</p> |
