| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent chipping and cracking in the process of cutting chips out of a wafer. <P>SOLUTION: On a surface of a semiconductor wafer 2, an etching inhibiting film 33 is formed (k), which has openings 35 corresponding to segmentation regions and has roundness corresponding to the corners of semiconductor device formation regions, and then the semiconductor wafer 2 is selectively etched and segmented into individual semiconductor devices 4 (l) with the etching inhibiting film 33 serving as a mask. Chipping and cracking are prevented because the semiconductor devices 4 are cut out of the semiconductor wafer 2 by means of etching. Chipping and cracking otherwise to occur during transfer or the like are prevented for a decrease in poor appearance and for an increase in reliability because the corners of the semiconductor devices 4 are made roundish at the time of segmentation of the semiconductor wafer 2 into the semiconductor devices 4. <P>COPYRIGHT: (C)2004,JPO</p> |
