发明名称 RESIN CURING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a resin curing method excellent in contact closeness between a resin and conveying tape, and causing no transformation including "burn" and "blister" of the resin. SOLUTION: The resin curing method uses a box body (1) and a gastight furnace body (2), the conveying tape (3) running through the furnace body (2) coated on its one face with the resin (5) sealing a bonded element (4). In the furnace body (2) are mounted a plurality of cure guides (6, 7) inverting the conveying tape (3), a plurality of heating elements (8, 9, 10) heating and curing the resin (5), a plurality of hot plates (11, 12, 13) heated with the heating elements (8, 9, 10), and a reflection plate (14) heating the reverse face of the conveying tape (3), thereby heating and curing the resin (5). COPYRIGHT: (C)2004,JPO
申请公布号 JP2004098063(A) 申请公布日期 2004.04.02
申请号 JP20030376036 申请日期 2003.11.05
申请人 ASURIITO FA KK 发明人 DOBASHI YOSHIHIRO
分类号 B05D3/02;B05C9/14;H01L21/56;(IPC1-7):B05C9/14 主分类号 B05D3/02
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