| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure for electronic components, which can reduce the thickness of a mounted substrate. SOLUTION: At the mounting position of an electronic component 12 provided on the surface of a circuit board 14, a housing section 31 in which the main body 21 of the component 12 is housed and arranged is formed through the circuit board 14 as a through hole having openings 30a and 30b respectively on the mounting surface 14a and the rear surface 14b of the board 14. The component 12 is mounted on the board 14 in a state where the main body 21 overlaps the board 14 in the thickness direction. A plurality of leads 22 respectively protruded from both outer side faces 21a of the main body 21 of the electronic component 12 are arranged in the gaps 33 provided between the external side faces 21a of the main body 21 and the internal wall surface 31a of the housing section 31. COPYRIGHT: (C)2004,JPO
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