WAFER FOR EVALUATING PACKAGE OF SEMICONDUCTOR CIRCUIT AND CHIP EVALUATING DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To manufacture package evaluating test chips having different sizes from one kind of semiconductor wafer. SOLUTION: On the semiconductor wafer 20, a plurality of single chips 21A, 21B, etc., each has wiring bonding pads 22A1, 22A2, etc., in its circumference and the size required for forming a circuit element. Adjacent wire bonding pads in and out of the single chips are connected to each other so that a daisy chain may be constituted in the wafer 20, and test chips 25 having almost the same size and shape as those of chips used for mass production are cut out from the wafer 20 and formed. COPYRIGHT: (C)2004,JPO