发明名称 |
ASSEMBLIES COMPRISING MOLYBDENUM AND ALUMINUM; AND METHODS OF UTILIZING INTERLAYERS IN FORMING TARGET/BACKING PLATE ASSEMBLIES. |
摘要 |
<p>The invention includes an assembly (130) having a physical vapor deposition target (102) separated from a backing plate (120) with a layer (104) consisting essentially of one or both of molybdenum and tantalum. The invention also includes an assembly comprising a backing plate of at least 99.9 % aluminum bound to a target of at least 99.9 % molybdenum through a bond having a strength of at least about 6,000 pounds per square inch (psi). Additionally, the invention includes a method of bonding a tungsten-containing material to an aluminum-containing material. A layer of molybdenum-containing material (104) is provided between the tungsten-containing material (102) and the aluminum-containing material (120); and is bonded to both the tungsten-containing material (102) and the aluminum-containing material (120).</p> |
申请公布号 |
MXPA03009665(A) |
申请公布日期 |
2004.04.02 |
申请号 |
MX2003PA09665 |
申请日期 |
2002.03.29 |
申请人 |
HONEYWELL INTERNATIONAL INC |
发明人 |
JOSH W. MISNER |
分类号 |
B23K20/02;B23K20/16;B23K20/233;C23C14/34;H01J37/34;H01L21/285;(IPC1-7):B23K28/00 |
主分类号 |
B23K20/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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