METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device wherein a reinforcing member can be bonded on a thinned semiconductor element without generating voids and defect of a shape. SOLUTION: In the method for manufacturing a semiconductor device, a semiconductor device is manufactured which device is formed by bonding the reinforcing member via resin adhesive agent 13 on a back of an electrode forming surface of a semiconductor element on which forming surface an electrode for external connection is formed. A semiconductor wafer 4 is mounted in a spacer ring 2 attached on a holding table 1. The liquid resin adhesive agent 13 is supplied to a central part of an upper surface of a semiconductor wafer 4 by a protruding shape whose central part is high. A reinforcing sheet 9 held by a holding head 10 is made to approach the semiconductor wafer 4 maintaining a parallel state, and the resin adhesive agent 13 is extended and subjected to thermosetting in a gap between the semiconductor wafer 4 and the reinforcing sheet 9. As a result, the semiconductor device can be manufactured without generating voids and defect of a shape. COPYRIGHT: (C)2004,JPO