| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which is ensured of interlayer connection and high in reliability. SOLUTION: In the production of the multilayer wiring board having an interlayer connection part which solders a wiring pattern adhered via an adhesive resin, a conductor post formed on the wiring pattern, a connection layer having a solder layer formed on the tip of the conductor post and a layer to be connected having a land for interlayer connection with the conductor post by thermocompressing them, the layer connection part composed of a metal alloy of copper and zinc is formed by compressing and soldering them and in such a case, the layer to be connected having the land for the interlayer connection and the connection layer having the solder layer are soldered before growing the solder alloy. COPYRIGHT: (C)2004,JPO |
