发明名称 METHOD AND APPARATUS FOR FORMING THICK FILM HAVING IMPROVED ADHESIVE FORCE WITH SURFACE MODIFIED MATRIX
摘要 PURPOSE: A method and an apparatus for forming thick film having improved adhesive force with surface modified matrix are provided to modify the surface of polymeric material by hydrophilicity and form a thick film having improved adhesive force with the polymeric material. CONSTITUTION: The apparatus is characterized in that vacuum tank of the apparatus is divided into five regions comprising an unloading region(1) for supplying the matrix for forming the thick film; a surface treating region(2) for modifying the surface of the matrix; a seed layer forming region(3) for forming a seed layer on the surface treated matrix; a thick film forming region(4) for forming the thick film on the seed layer formed matrix; and a loading region(5) for loading the thick film formed matrix; a matrix(6) formed of a polymeric material, wherein the unloading region and loading region comprise a transfer unit(7) for transferring the matrix to the surface treating region, seed layer forming region and thick film forming region, wherein the surface treating region comprises first and second surface treating ion sources(10,11) comprising first and second gas supply ports(8,9) into which a reactive gas is flown, an ionization part for ionizing an inert gas or reactive gas separately supplied to the ion sources and an inert gas separately supplied to the ion sources, and an acceleration part for extracting the accelerated gas ions as ions by accelerating the ionized gas ions, wherein an ion beam having an energy at first sputter depositing ion source(12) and second sputter depositing ion source(13) is irradiated onto first sputter target(14) and second sputter target(15), and wherein the thick film forming region comprises first cathode target(16) and second cathode target(17) for sputtering magnetron.
申请公布号 KR20040026733(A) 申请公布日期 2004.04.01
申请号 KR20020058265 申请日期 2002.09.25
申请人 P&I CORPORATION 发明人 BAEK, YEONG HWAN;CHO, JUN SIK;HAN, SEONG;KO, SEONG SU;LEE, CHEOL SU;SUK, JIN U
分类号 C23C14/02;C23C14/20;C23C14/56;C23C18/20;C25D5/56;H05K3/38;(IPC1-7):C23C14/02 主分类号 C23C14/02
代理机构 代理人
主权项
地址