LEADFRAME-BASED COMPONENT HOUSING, LEADFRAME STRIP, SURFACE-MOUNTED ELECTRONIC COMPONENT, AND PRODUCTION METHOD

摘要

The invention relates to a leadframe-based housing for a surface-mounted component, particularly a radiation-emitting component. Said leadframe-based housing comprises electrical connector strips and at least one chip assembly area. One of the inventive connector strips is provided with a spray-on window allowing a leadframe-based housing having a reduced thickness to be produced in an injection molding process. Also disclosed is a method for producing such housings.