发明名称 CAMERA MODULE TO REDUCE AREA NECESSARY FOR MOUNTING CHIP SET
摘要 PURPOSE: A camera module is provided to reduce an area necessary for mounting a chip set constituting a camera module by fixedly forming an image device of a stack structure on a face-down mounted signal process device. CONSTITUTION: A conductive pattern is prepared. A signal process device(12) is face-down mounted on the conductive pattern so that the surface of the signal process device on which a device is formed is light-shielded. An image device(13) is fixedly formed on the signal process device. The image device is electrically connected to the conductive pattern by a metal wire(16). The signal process device, the image device and the metal wire are coated with transparent resin(15). A lens(24) is located above the image device.
申请公布号 KR20040027351(A) 申请公布日期 2004.04.01
申请号 KR20030065050 申请日期 2003.09.19
申请人 SANYO ELECTRIC CO., LTD. 发明人 KOBAYASHI KENICHI;TAMURA HIROYUKI
分类号 H01L27/14;H01L23/00;H01L27/146;H01L31/0203;H01L31/0232;H04N5/225;H04N5/335 主分类号 H01L27/14
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