发明名称 |
CAMERA MODULE TO REDUCE AREA NECESSARY FOR MOUNTING CHIP SET |
摘要 |
PURPOSE: A camera module is provided to reduce an area necessary for mounting a chip set constituting a camera module by fixedly forming an image device of a stack structure on a face-down mounted signal process device. CONSTITUTION: A conductive pattern is prepared. A signal process device(12) is face-down mounted on the conductive pattern so that the surface of the signal process device on which a device is formed is light-shielded. An image device(13) is fixedly formed on the signal process device. The image device is electrically connected to the conductive pattern by a metal wire(16). The signal process device, the image device and the metal wire are coated with transparent resin(15). A lens(24) is located above the image device. |
申请公布号 |
KR20040027351(A) |
申请公布日期 |
2004.04.01 |
申请号 |
KR20030065050 |
申请日期 |
2003.09.19 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
KOBAYASHI KENICHI;TAMURA HIROYUKI |
分类号 |
H01L27/14;H01L23/00;H01L27/146;H01L31/0203;H01L31/0232;H04N5/225;H04N5/335 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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