发明名称 |
Electronic component with a stack of semiconductor chips and a method for producing the electronic component |
摘要 |
The invention relates to a method for producing an electronic component, a stack of semiconductor chips, and an electronic component including a stack of semiconductor chips. The stack has at least a lower electronic module connected via flipchip connections to a central area of a rewiring substrate. The stack also has at least an upper electronic module with external contact surfaces connected via bonding connections to outer areas of the rewiring substrate.
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申请公布号 |
US2004063304(A1) |
申请公布日期 |
2004.04.01 |
申请号 |
US20030669539 |
申请日期 |
2003.09.24 |
申请人 |
HAGEN ROBERT-CHRISTIAN;WOERNER HOLGER |
发明人 |
HAGEN ROBERT-CHRISTIAN;WOERNER HOLGER |
分类号 |
H01L25/065;(IPC1-7):H01L21/44 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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