发明名称 |
Discrete package having insulated ceramic heat sink |
摘要 |
Discrete semiconductor packages are described. The discrete package contains: a lead frame pad which has a first surface and a second surface, wherein the second surface which is the opposite surface of the first surface; leads connected to a side of the lead frame pad; a semiconductor chip attached to the first surface of the lead frame pad; a ceramic layer that directly contacts the second surface of the lead frame pad; and a molding material that entirely encapsulates the lead frame pad, the semiconductor chip, and a portion of the ceramic layer, except for a portion of the leads and the second surface of the ceramic layer. Methods for making such discrete packages are also described.
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申请公布号 |
US2004061206(A1) |
申请公布日期 |
2004.04.01 |
申请号 |
US20030672346 |
申请日期 |
2003.09.26 |
申请人 |
SON JOON-SEO;BAEK JONG-HWAN;LEE TAEK-KEUN |
发明人 |
SON JOON-SEO;BAEK JONG-HWAN;LEE TAEK-KEUN |
分类号 |
H01L23/36;H01L23/433;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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