发明名称 |
Selective polishing with slurries containing polyelectrolytes |
摘要 |
Polishing rate selectivity is increased by providing a polyelectrolyte in the polishing slurry. The polishing selectivity of silicon oxide to silicon nitride is enhanced by using an anionic polyelectrolyte. The polishing selectivity of metals to silicon oxide, silicon nitride and/or silicon oxynitride is increased by using a cationic polyelectrolyte.
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申请公布号 |
US2004060472(A1) |
申请公布日期 |
2004.04.01 |
申请号 |
US20030673347 |
申请日期 |
2003.09.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
RONAY MARIA |
分类号 |
C09G1/02;H01L21/3105;(IPC1-7):C09G1/00 |
主分类号 |
C09G1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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