METHOD FOR THE PRODUCTION OF CONTACT PADS ON A SUBSTRATE AND DEVICE FOR CARRYING OUT SAID METHOD

摘要

The invention relates to a method for producing at least one electric contact pad on a receiving pad (2) of an electronic component, wherein: a liquid alloy (4) is injected into at least one duct (5) which comprises a routing part (5A) and a molding part (5B) which are separated by a contraction, said duct (5) being disposed in such a way that the moulding part (5B) leads to the receiving pad (2); the moulding part (5B) and the receiving pad (2) are separated before full solidification of the metal or alloy (4) while the routing part (5A) and moulding part (5B) remain joined. The invention is characterized in that the routing part (5A) is part of a first part forming a die (6) and the moulding part (5B) is part of a second distinct part forming a mould (7), the die and mould being juxtaposed in order to form the duct (5). The invention is used to produce contact pads for electronic components.