发明名称 Semiconductor equipment
摘要 Semiconductor equipment includes a semiconductor substrate with a semiconductor layer embedded therein and a vertical type transistor. The substrate has a principal side, a rear side opposite to the principal side, and a trench disposed in the rear side of the substrate. The vertical type transistor has a first electrode disposed in the principal side of the substrate, a second electrode disposed in the rear side, and a diffusion region disposed in the principal side. The first electrode connects to the diffusion region through an interlayer insulation film. The second electrode is disposed in the trench and connects to the semiconductor layer exposed in the trench. This vertical transistor has a low ON-state resistance.
申请公布号 US2004061163(A1) 申请公布日期 2004.04.01
申请号 US20030662370 申请日期 2003.09.16
申请人 发明人
分类号 H01L29/41;H01L21/331;H01L21/8222;H01L21/8234;H01L21/8248;H01L21/8249;H01L23/367;H01L23/48;H01L27/04;H01L27/06;H01L27/08;H01L27/088;H01L29/06;H01L29/08;H01L29/417;H01L29/73;H01L29/732;H01L29/739;H01L29/78;(IPC1-7):H01L27/108;H01L31/119;H01L29/94;H01L29/76 主分类号 H01L29/41
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