发明名称 |
Light emitting device and manufacturing method thereof |
摘要 |
In a light emitting device, a light emitting element which includes a transparent substrate and a stack of GaN-based compound semiconductor layers formed on the first surface of the transparent substrate is mounted on a lead frame or a printed circuit board so that the transparent substrate is located on the side of the stack of GaN-based compound semiconductor layers opposite to the lead frame or the printed circuit board. The second surface of the transparent substrate opposite to the first surface contains a portion inclined with respect to the first surface. Alternatively, an optical member is arranged in contact with the second surface of the transparent substrate, where a surface of the optical member located on the opposite side to the transparent substrate contains a portion inclined with respect to the first surface of the transparent substrate.
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申请公布号 |
US2004061120(A1) |
申请公布日期 |
2004.04.01 |
申请号 |
US20030670740 |
申请日期 |
2003.09.26 |
申请人 |
FUJI PHOTO FILM CO., LTD. |
发明人 |
MIZUYOSHI AKIRA |
分类号 |
H01L33/32;H01L33/60;H01L33/62;(IPC1-7):H01L27/15;H01L31/12;H01L33/00 |
主分类号 |
H01L33/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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