| 摘要 |
The present invention relates to a process for producing interconnects in a multilayer printed circuit. Said circuit comprising a stack of printed circuits. The process is carried out according to the following steps: a step of producing plated holes in elementary printed circuits; a step in which the holes and the elements to which they have to be electrically connected are covered with a metallic interface (61, 62); a step in which the metallic interfaces (61, 62) are covered with a component of a metal alloy, the metallic interface (61) of a hole being covered with a first component (71) and the metallic interface (62) of the element to be electrically connected to this hole being covered with a second component (72), these two metallic components (71, 72) being brought into contact with each other while pressure is being exerted on the stack in order to form the multilayer printed circuit; a step (73) of heating the assembly. The invention applies, for example, to digital circuits having a high integration density or to microwave circuits.
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